Interdiffusion at interfaces between deuterated polyamic acid (d-PAA) and polyimide (PI) films was investigated with forward recoil spectrometry, an ion beam analysis technique. The PI films were prepared by spin coating a solution of PAA on a silicon substrate, followed by an anneal at a temperature Ti, which produced partial or complete conversion of the PAA to PI. An overlayer of d-PAA was added, in one set of samples by spin coating from solution, and in another set by transferring (in the absence of solvents) a dry d-PAA film onto the PI surface. The bilayer samples were then either annealed at a temperature Ta or allowed to stand at room temperature. No interdiffusion occurred in the solventless transfer samples for any combination of temperatures T~ or Td from room temperature up to 400°C. Bilayers prepared by spin coating d-PAA from solution directly on partially cured PI films did, however, show significant interdiffusion distances w, which decreased with increasing values of Ti to immeasurable levels by T~ = 200°C. The decrease in w with increasing T~ is thought to be caused by a positive Flory parameter between PAA and PI which increases with the imide fraction in the PI film ; the result is an increasing immiscibility between the swollen polymer layers. Subsequent annealing of these spin-coated bilayers at a temperature T a up to 400°C was ineffective in producing any additional interdiffusion. The absence of any thermally activated interdiffusion (even for initially unimidized samples), with either the solventless-transfer or spin-coated preparation methods m
Посилання на статтю:
Interdiffusion at polyimide interfaces / S. F. Tead* and E. J. Kramer // Polymer. – 1992. – Vol 33. – P. 3382-3387.