New high-temperature adhesives based on polyisoimide (PII) have been developed. PIIs were prepared by the ring-opening polyaddition of 4,4'-hexafluoroisopropylidenebis(phthalic anhydride) and 4,4'-[hexafluoroisopropylidenebis( p-phenyleneoxy)]dianiline or 4,4'-[isopropylidenebis(p-phenyleneoxy)]dianiline, followed by treatment with trifluoroacetic anhydride-triethylamine in N-methyl-2-pyrrolidone. Compared to those of polyimides (PIs), the glass transition temperatures (T~) of PIIs were lower and the elasticities were greatly reduced above their Tg. Furthermore, PIIs showed stronger adhesion to copper foils. The interfacial surface morphologies of PII films after adhesion testing were investigated by scanning electron microscopy and energy-dispersive X-ray analysis. The results suggested that the good adhesion bond strength was produced by favourable anchoring between PII and copper foil due to a good flow of PII.
Посилання на статтю:
Preparation and adhesion properties of polyisoimide as a high-temperature adhesive / Amane Mochizuki*, Tadashi Teranishi and Mitsuru Ueda // Polymer. – 1994. – Vol 35. – P. 4022-4027.