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Introducing crystallinity in polyimides offers the advantage of increased solvent resistance and retention of mechanical properties above the glass transition temperature (T g). This work examines the thermal stability, semicrystalline morphology and adhesive properties of a new polyimide based on 1,3-bis(4-aminophenoxy) benzene (TPER diamine) and 3,3’,4,4’-biphenyltetracarboxylic dianhydride (BPDA). The polymer has a T g of approx. 210°C and a T m of 395°C. Polarized light microscopy was used to evaluate the morphology and spherulitic growth rates from the melt for M n ¼ 15 000 dalton and M n ¼ 30 000 dalton molecular weight polymer. Lap-shear specimens were made using Ti–6Al–4V alloy coupons using a melt process. Three surface treatments: gritblasting, chromic acid anodization and sodium hydroxide etch were evaluated and it was found that macroroughness provided by gritblasting was sufficient in providing a strong interface. The bonding conditions were optimized with respect to bonding temperature, bonding time and pressure, and adhesive bonds made using the optimized conditions displayed a bondline thickness of approx. 2–3 mils. High room temperature lap-shear strengths of more than 6000 psi were obtained and the fracture surface investigation using the SEM revealed a very rough and plastically deformed surface. Durability studies on lap-shear specimens were conducted for aging and testing temperatures of ambient, 177°C and 232°C. Significant stability was observed for all these aging and testing temperatures for a period up to seven weeks. The bond strengths were found to be affected by testing temperatures rather than the aging conditions for the duration of the study. The influence of various solvents on the lap-shear strengths was investigated by immersing the specimens in these solvents for 9 days. None of the solvents had any major effect on the strength of lap-shear specimens.

Посилання на статтю:

A melt-processable semicrystalline polyimide structural adhesive based on 1,3-bis(4-aminophenoxy) benzene and 3,3’,4,4’-biphenyltetracarboxylic dianhydride / Varun Ratta, Edward J. Stancik, Amba Ayambem, Hari Pavatareddy, James E. McGrath, Garth L. Wilkes // Polymer. – 1999. – N 40. – P. 1889–1902.

A melt-processable semicrystalline polyimide structural adhesive based on 1,3-bis(4-aminophenoxy) benzene and 3,3’,4,4’-biphenyltetracarboxylic dianhydride - Завантажити.