A positive-working photosensitive polyimide (PI) precursor based on fluorinated polyisoimide (FPII) and 2,3,4-tris( 1-oxo-2-diazonaphthoquinone-5-sulfonyloxy)benzophenone (DSSB) as a photosensitive compound has been developed. FPII was prepared by ring-opening polyaddition of dianhydrides, pyromellitic dianhydride and biphenyltetracarboxylic dianhydride, with diamine, 2,2’and followed by treatment with trifluoroacetic anhydride-triethylamine in N-methyl-2-pyrrolidinone. The FPII bis(trifluoromethyl)benzidine film showed a good solubility in a wide range of organic solvents. The dissolution behaviour of FPII containing 30 wt% of DSSB after exposure was studied and it was found that the difference of dissolution rate between the exposed and the unexposed parts was enough to get a positive pattern due to photochemical reaction of DSSB in the polymer film. The photosensitive fluorinated polyimide (FPI) precursor containing 30 wt% of DSSB showed a sensitivity of 250 mJ cm-1 and a contrast of 1.5 with 436 nm light, when it was developed with a mixture of 2.38% aqueous tetramethylanunonium hydroxide solution and 2-propanol at room temperature. The FF’I film cured up to 360°C had a low coefficient of thermal expansion of 10.8 ppm “Cm’ and a low dielectric constant of 2.89
Посилання на статтю:
(I 999) 55 I-558 Photosensitive polyimide-precursor based on polyisoimide: dimensionally stable polyimide with a low dielectric constant / Hiroshi Seino, Osamu Haba, Mitsuru Ueda, Amane Mochizuki // Polymer. – 1999. – N 40. – P. 551–558.
